Typical process flow
Multilayer lamination → diffusion bonding → kunopisa kukotama uye kumonyorora preforming → chimiro preprocessing → kupisa gasi rekuwedzera kuumba → kunotevera polishing
Kambani yedu inoshanda mukupa ekupedzisira-yakanyanya kudzvanya inopisa gasi yekuwedzera yekuumba tekinoroji uye michina yezvakaoma simbi zvinhu zvakaita setitanium alloy, aluminium magnesium alloy uye zvimwe zvakaoma kuumba.
Nguva yekutumira: Sep-27-2023